Over 20 Years of Experience in FR-4 Project
FR-4 is the most widely used PCB substrate, and almost every manufacturer can produce it. But at PCBCool, our 20 years of operational and technical expertise allow us to go further, offering a broader and more advanced range of services.
We deliver end-to-end FR-4 PCB solutions, from design concept to complete system assembly. Using sequential build-up technology, we can build highly complex multilayer structures, including 4+N+4 configurations.
This means we can meet virtually any project requirement, from standard consumer electronics to high-performance AI training servers and other demanding applications.
FR-4 PCB Technology Capabilities
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| Materials | |||
| FR4 Regular | Shengyi, ITEQ, KB, Nanya | ||
| FR4 Mid. Tg | Shengyi S1000, ITEQ IT158, etc | ||
| FR4 High Tg | Shengyi S1000‐2, S1170, EMC EM827, Isola 370HR, ITEQ IT180A, Panasonic R1755V.. | ||
| Production Capabilities | |||
| Specifications | Standard | Max. | |
| Max. Layer | 32 | 40 | |
| Max. PCB Size | 510*610mm | 620*720mm | |
| Min. Trace Width / Spacing | 0.08/0.08mm | 0.0635/0.0635mm | |
| Board Thickness | Min. | 0.40mm | 0.20mm |
| Max. | 3.20mm | 6.50mm | |
| Min. Hole Size | Mechanical Drilling | 0.20mm | 0.15mm |
| Laser Drilling | 0.10mm | 0.08mm | |
| Aspect Ratio | 25:1 | 35:1 | |
| Min. Basic Copper | 1/3oz [12µm] | 1/4oz [12µm] | |
| Max. Basic Copper | 10oz [350µm] | 33oz [1155µm] | |
| Core Thickness | 50um | 38um | |
| PP Thickness | 64um | 38um | |
| Min. Hole Pad | 0.46mm | 0.40mm | |
| Solder Mask | Registration | ± 50µm | ± 38µm |
| Min. Solder Mask Dam | 76um | 50um | |
| Outline Tolerance | ±0.10mm | ±0.05mm | |
| Surface Finish | Immersion gold, lead-free HASL, OSP, immersion tin, immersion silver, immersion nickel-palladium-gold, gold finger, electro-thin gold, full-board electro-hard gold, combined (e.g., HASL + electro-gold, OSP + immersion gold, etc.) | ||
| China Mainland Base | Malaysia Base | Mexico Base |
|---|---|---|---|
| Turnkey Service | Design + PCB FAB + Components Sourcing + PCB Assembly + Product Assembly | Components Sourcing + PCB Assembly + Product Assembly | Components Sourcing + PCB Assembly |
| Assembly Technologies | THT, SMT, Hybrid Mount, Subsystem Assembly | THT, SMT, Hybrid Mount, Semi Assembly | THT, SMT, Hybrid Mount, Subsystem Assembly |
| Manufacturing Abilities | Prototyping, Low to High Volume | Prototyping, Low/Medium/High Volume | Prototyping, Low to Medium Volume |
| Component Abilities | Chips 0201mm BGA, QFP & CSP 0.25mm BGA repair and reball | Chips 0402mm BGA, QFP & CSP 0.25mm HDMI Connectors / Micro USB Connectors | Chips 0402mm BGA, QFP & CSP 0.3mm Press Fit / High Pin Count Connectors |
| SMT Lines | 11 Lines, Samsung / JT | 9 Lines, Samsung / Panasonic / Sony | 5 Lines, Siemens / Samsung |
| SMT Capabilities | Monthly 788 Million Points | Monthly 298 Million Points | Monthly 63 Million Points |
| THT Lines | 3 Lines, Auto / Manual | 4 Lines, Auto / Manual | 2 Lines, Auto / Manual |
| Inspection Machines | SPI, AOI, 2D X-Ray | SPI, Optical Measuring (VMS-4030M), X-ray (SMX-1000) | SPI, AOI, X-ray, Microscope to 20X |
| Testing | ICT/Function test/Burn-in test/Aging Testing | ICT/Function test/Burn-in test | ICT/Function test/Burn-in test |
| Assembly Cost | Lower Costs | Lower Costs | Medium Cost |
| Lead Time | As fast as 9 days with shipping | As fast as 7 days with shipping | As fast as 3 days with shipping |
| Number of layers | S<1m² | 1≤S<5m² | 5≤S<20m² | 20≤S<50m² | 50≤S<100m² | 100m²以上 | Expedited (≤3㎡) |
|---|---|---|---|---|---|---|---|
| 2L | 4 | 5-7 | 5-7 | 6-9 | 8-10 | 9-12 | 12~24 hours |
| 4L | 5 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 1~4 working days |
| 6L | 6 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 2~4 working days |
| 8L | 7 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 4~6 working days |
| 10L | 9 | 9-11 | 9-11 | 10-12 | 12-14 | 13-17 | 5~9 working days |
| 12L | 10 | 10-12 | 10-12 | 11-13 | 13-15 | 14-18 | 7~14 working days |
| 14L | 10 | 10-12 | 10-12 | 11-13 | 13-15 | 14-18 | 7~14 working days |
| 16L | 11 | 13 | 13 | 15 | 16 | 17 | Contingent |
| 18L | 12 | 14 | 14 | 16 | 17 | 18 | Contingent |
| 20L | 13 | 14 | 14 | 16 | 18 | 19 | Contingent |
| 22L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 24L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 26L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 28L+ | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
Commitment to Quality
Certification Compliance Support
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Support for ISO 9001 quality management system
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Compliance with ISO 14001 environmental management system
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Adherence to ISO 45001 occupational health and safety standards
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Compliance with IPC-A-610 and IPC J-STD-001 standards
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Support for RoHS / REACH environmental compliance
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Support for UL and CE certifications
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Support for ISO 13485, IEC 62031, and other industry-specific certifications
Manufacturing Process Control
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Full BOM and lot traceability across production
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Material traceability (components, boards, solder paste, etc.)
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Process documentation for regulated manufacturing
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First Article Inspection (FAI) support
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In-process quality checks and monitoring
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Controlled ESD & cleanroom processes (if applicable)
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Complete inspection records and test reports
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Change control and nonconformance management
End-to-End Solutions
No matter which phase your project is in, PCBCool can offer the support and expertise you need to move it forward successfully.
Cutting-Edge Technologies
Our factory is equipped with state-of-the-art facilities to handle all FR-4 PCB project requirements with precision and attention to detail.
Why Choose PCBCool as Your FR -4 PCB Manufacturer
FR-4 PCB manufacturing and assembly rely on stable materials, well-established processes, and strict quality control.
If you want to achieve better product quality and service while maintaining cost efficiency —
Case Studies
Frequently Asked Questions
A: FR-4 is not a single uniform material; different manufacturers and resin systems can lead to variations in Dk and Df. Typically:
- Dielectric constant (Dk): About 4.2–4.8 at 1 MHz, slightly decreasing at higher frequencies. In the GHz range, Dk is usually around 4.0–4.5.
- Loss tangent (Df): Typically 0.015–0.025, increasing with frequency, and may reach 0.02–0.03 or higher at high frequencies.
A: Standard FR-4 has a Tg of approximately 130–140°C, while high-Tg FR-4 can reach 170–180°C or higher. The Td of FR-4 is typically around 350°C.
A: The CTE of FR-4 is approximately 14–17 ppm/°C in the X/Y (in-plane) directions, while significantly higher in the Z (thickness) direction, around 60–80 ppm/°C.
A: FR-4 is a conventional substrate with no inherent layer limitations. The achievable number of layers depends on the manufacturer’s capabilities, board thickness, and process requirements. For example, PCBCool can produce high-layer FR-4 boards with up to 40 layers.
A: FR-4 has a low thermal conductivity (~0.3–0.4 W/m·K), which can lead to heat accumulation in high-power designs. With proper design measures such as increased copper thickness, thermal vias, copper fills, or external heat sinks, FR-4 can safely support medium-to-high power circuits.
A: Yes, FR-4 is the most commonly used material for HDI (High-Density Interconnect) designs. For advanced HDI with multiple microvias, blind vias, or buried vias, the feasibility depends on the manufacturer’s microvia processing capabilities.
A: Yes, most FR-4 materials comply with RoHS and REACH standards, meeting electronic product restrictions on hazardous substances. For stricter environmental requirements, PCBCool also offers halogen-free FR-4 options.
A: Although FR-4 absorbs some moisture (typical absorption ~0.1–0.3%), PCBCool can make it suitable for high-humidity projects through conformal coatings and engineering optimization recommendations.
A: PCBCool offers a one-stop service covering FR-4 PCB design support, PCB fabrication, SMT/DIP assembly, and complete box-build assembly, supporting the full process from prototype development to mass production.
A: Yes, our factory uses fully automated equipment with a monthly PCB production capacity of 220,000 m² and a daily SMT placement capability of 15 million points.
A: Yes, we provide both differential and single-ended impedance control. Simulation and TDR testing are used to ensure signal integrity meets design requirements.
A: Yes, we offer FR-4 ranging from standard grades up to high Tg 180°C, covering nearly all requirements.
A: Yes, PCBCool provides custom assembly services, and design, procurement, manufacturing, and assembly can be handled separately or in combination.
A: We follow IPC Class 2/3 standards. Experienced technicians manage the production process, and inspections such as AOI, X-ray, electrical testing, and process control systems ensure reliable FR-4 PCB and PCBA quality.
A: Simply contact us. Our sales and engineering teams will reach out promptly. Providing design files or clear requirements will accelerate the process, and all information is kept confidential.
A: We support all major design file formats including Gerber, ODB++, and IPC-2581.
With PCBCool, You Get More Than Assembly
you get a partner committed to zero defects, global compliance, and lasting reliability.
