Extensive Experience in Rogers PCB Projects
With more than 20 years of experience in the PCB industry, PCBCool has developed solid project experience in high-frequency applications such as RF, microwave, radar, and antenna systems. Many of these projects involve Rogers materials, giving us a stronger understanding of their performance characteristics, manufacturing priorities, and application requirements.
Based on this experience, our engineering team can provide more practical support in material selection, stack-up evaluation, and manufacturing planning. This helps customers move more smoothly from design verification to production, with better alignment between engineering requirements and manufacturing execution.
At the same time, our stable order volume and long-term sourcing relationships help us maintain a more reliable supply of Rogers materials. We can turn that supply advantage into more competitive manufacturing solutions, and for assembly projects, our component sourcing capability can also help optimize overall project cost.
Rogers PCB Technology Capabilities
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|---|---|
| Available Materials | RO4000 Series, RO3000 Series, RT/duroid Series, and TMM Series |
| Max. Layer Count | 24 layers |
| Max. Board Thickness | 6.0 mm |
| Mixed Lamination | Rogers + FR-4, Rogers + Rogers, Rogers + Copper, Rogers + Metal Core |
| Dielectric Constant (Dk) | 2.2–12.85* |
| Dissipation Factor (Df) | 0.0009–0.0037* |
| Microwave Frequency / Data Rate | Up to 128 GHz / 128 Gbps** |
| High-speed Impedance Tolerance | ±8% (>50Ω); ±5Ω (≤50Ω) |
| Surface Finishes | Immersion Silver, Immersion Tin, Hard Gold Plating, Silver Plating |
| Max. PCB Size | 510 × 620 mm |
| Trace Tolerance | ±0.015 mm |
| Min. Trace / Spacing | 0.08 / 0.08 mm |
| Min. Hole Size | 0.08 mm |
| PTH Treatment | Plasma, Ultrasonic Cleaning |
| Solder Mask Pre-treatment | Sand Blasting, Surface Roughening |
| China Mainland Base | Malaysia Base | Mexico Base |
|---|---|---|---|
| Turnkey Service | Design + PCB FAB + Components Sourcing + PCB Assembly + Product Assembly | Components Sourcing + PCB Assembly + Product Assembly | Components Sourcing + PCB Assembly |
| Assembly Technologies | THT, SMT, Hybrid Mount, Subsystem Assembly | THT, SMT, Hybrid Mount, Semi Assembly | THT, SMT, Hybrid Mount, Subsystem Assembly |
| Manufacturing Abilities | Prototyping, Low to High Volume | Prototyping, Low/Medium/High Volume | Prototyping, Low to Medium Volume |
| Component Abilities | Chips 0201mm BGA, QFP & CSP 0.25mm BGA repair and reball | Chips 0402mm BGA, QFP & CSP 0.25mm HDMI Connectors / Micro USB Connectors | Chips 0402mm BGA, QFP & CSP 0.3mm Press Fit / High Pin Count Connectors |
| SMT Lines | 11 Lines, Samsung / JT | 9 Lines, Samsung / Panasonic / Sony | 5 Lines, Siemens / Samsung |
| SMT Capabilities | Monthly 788 Million Points | Monthly 298 Million Points | Monthly 63 Million Points |
| THT Lines | 3 Lines, Auto / Manual | 4 Lines, Auto / Manual | 2 Lines, Auto / Manual |
| Inspection Machines | SPI, AOI, 2D X-Ray | SPI, Optical Measuring (VMS-4030M), X-ray (SMX-1000) | SPI, AOI, X-ray, Microscope to 20X |
| Testing | ICT/Function test/Burn-in test/Aging Testing | ICT/Function test/Burn-in test | ICT/Function test/Burn-in test |
| Assembly Cost | Lower Costs | Lower Costs | Medium Cost |
| Lead Time | As fast as 9 days with shipping | As fast as 7 days with shipping | As fast as 3 days with shipping |
| Number of layers | S<1m² | 1≤S<5m² | 5≤S<20m² | 20≤S<50m² | 50≤S<100m² | 100m²以上 | Expedited (≤3㎡) |
|---|---|---|---|---|---|---|---|
| 2L | 4 | 5-7 | 5-7 | 6-9 | 8-10 | 9-12 | 12~24 hours |
| 4L | 5 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 1~4 working days |
| 6L | 6 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 2~4 working days |
| 8L | 7 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 4~6 working days |
| 10L | 9 | 9-11 | 9-11 | 10-12 | 12-14 | 13-17 | 5~9 working days |
| 12L | 10 | 10-12 | 10-12 | 11-13 | 13-15 | 14-18 | 7~14 working days |
| 14L | 10 | 10-12 | 10-12 | 11-13 | 13-15 | 14-18 | 7~14 working days |
| 16L | 11 | 13 | 13 | 15 | 16 | 17 | Contingent |
| 18L | 12 | 14 | 14 | 16 | 17 | 18 | Contingent |
| 20L | 13 | 14 | 14 | 16 | 18 | 19 | Contingent |
| 22L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 24L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 26L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 28L+ | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
Commitment to Quality
Certification Compliance Support
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Support for ISO 9001 quality management system
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Compliance with ISO 14001 environmental management system
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Adherence to ISO 45001 occupational health and safety standards
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Compliance with IPC-A-610 and IPC J-STD-001 standards
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Support for RoHS / REACH environmental compliance
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Support for UL and CE certifications
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Support for ISO 13485, IEC 62031, and other industry-specific certifications
Manufacturing Process Control
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Full BOM and lot traceability across production
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Material traceability (components, boards, solder paste, etc.)
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Process documentation for regulated manufacturing
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First Article Inspection (FAI) support
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In-process quality checks and monitoring
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Controlled ESD & cleanroom processes (if applicable)
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Complete inspection records and test reports
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Change control and nonconformance management
From Prototyping to Delivery
PCBCool provides manufacturing support across multiple stages of Rogers PCB projects, helping customers move step by step from early validation to stable volume production.
Cutting-Edge Technologies
With deep Rogers material knowledge and continued investment in advanced equipment, PCBCool supports more complex and higher-spec PCB projects.
Why Choose PCBCool as Your Rogers PCB Manufacturer
Success in Rogers PCB projects depends not only on the material itself but also on engineering understanding, process control, and stable impedance management.
If you are looking for a manufacturing partner that truly understands Rogers materials and can deliver with consistency for high-frequency projects —
Case Studies
Frequently Asked Questions
A: Yes. Once you send us the design files, our engineering team will first review the key requirements and then confirm the stack-up, material, and production-related details with you so the project can move forward smoothly.
A: Yes. After you share your project requirements, we will work with you to confirm a more suitable material option based on the application and structural requirements.
A: Yes. We can support production for Rogers + FR-4, Rogers + Rogers, and other hybrid stack-up structures.
A: Please usually provide Gerber files, stack-up information, material requirements, board thickness, copper thickness, surface finish, impedance requirements, quantity, and whether assembly is needed. The more complete the information is, the faster the quotation and project confirmation will be.
A: Yes. For projects with impedance requirements, we will confirm the production approach based on the material, stack-up, and design files, and then proceed with the following manufacturing steps.
A: Yes. We support the full Rogers material range and can arrange production according to the exact material grade you specify.
A: Yes. We can support samples, low-volume production, and new project introduction stages.
A: Yes. We provide turnkey EMS solutions, covering design, fabrication, and assembly.
A: Of course. We are primarily a B2B-oriented company, and we are especially well positioned to support volume production.
A: Yes. We support both online and offline communication.
A: Yes. Before formal production, we will review the key manufacturing-related points again to help the project move into mass production more smoothly.
With PCBCool, You Get More Than Assembly
you get a partner committed to zero defects, global compliance, and lasting reliability.
