We accept Gerber files (RS-274X), BOM in Excel/CSV format, and centroid/pick-and-place files (XY coordinates). ODB++ and IPC-2581 formats are also supported. Our engineering team will review your files within 24 hours and provide DFM feedback.

We have no strict MOQ for prototypes and accept orders as small as 5-10 pieces. For production runs, we recommend quantities of 50+ units for optimal pricing, though smaller batches are accommodated based on project requirements.

Yes, complimentary DFM/DFA analysis is included with every quote. Our engineers check for component spacing, pad geometry, stencil aperture design, thermal relief adequacy, and assembly clearances. We provide detailed reports with recommendations to improve manufacturability and reduce costs.

We handle components from 01005 (0.4mm x 0.2mm) chip components up to large connectors and transformers. BGA packages down to 0.25mm pitch are standard. We also support press-fit connectors, through-hole components, and mixed-technology assemblies.

All BGA, QFN, and other leadless packages undergo mandatory X-ray inspection to verify solder joint quality, check for voids, and detect bridging. Our X-ray systems provide real-time imaging with automated defect recognition algorithms.

We operate as a turnkey manufacturer and source all components through authorized distributors including Microchip, TI, Arrow, Avnet, Future Electronics, Element14, and Digi-Key. This ensures authentic parts with full traceability and eliminates counterfeit risk.

We offer flying probe testing, in-circuit testing (ICT), functional circuit testing (FCT) with custom fixtures, burn-in testing (24-72 hours), boundary scan testing, and environmental stress screening. FCT programs can be developed based on your functional specifications.

Yes, our Malaysia facility is equipped with N₂ generators and nitrogen atmosphere reflow ovens. Nitrogen reflow reduces oxidation, improves solder wetting, and enhances joint reliability particularly for lead-free alloys and sensitive components.

We exclusively source from authorized distributors and franchised channels. All incoming components undergo date code verification, visual inspection, and sample testing. Our barcode warehouse system maintains complete chain-of-custody documentation from procurement through assembly.

Standard documentation includes First Article Inspection (FAI) reports, Certificate of Conformance (CoC), test data for ICT/FCT, X-ray images for critical components, and traceability reports. Additional documentation such as 8D reports and SCAR (Supplier Corrective Action Request) forms are available upon request.