20+ Years of MCPCB Project Management Experience
Over the past two decades, PCBCool has successfully delivered 5,200+ PCB projects, including numerous applications with stringent thermal performance requirements, such as LED lighting, power modules, power electronics, and automotive electronics.
Within these projects, Metal Core PCB (MCPCB), also known as Insulated Metal Substrate (IMS PCB) or Metal-Backed PCB, are widely used due to their exceptional heat dissipation capabilities. Extensive project experience has not only honed our manufacturing expertise but also provided deep insight into the core thermal management challenges of high-power electronic products.
With a customer satisfaction rate of up to 99.5%, our service capabilities have been thoroughly validated in real-world projects. Upon receiving client design files, our engineering team performs comprehensive reviews and can provide targeted thermal optimization and manufacturability improvement recommendations to help clients achieve more stable and reliable product performance.
MCPCB Technology Capabilities
 | Aluminum-Based PCB | Copper-Based PCB |
|---|---|---|
| Quality Grade | Standard IPC Class 2/3 | Standard IPC Class 2/3 |
| Order Quantity | 1 pc – 10,000+ pcs | 1 pc – 10,000+ pcs |
| Layer Count | 1 – 6 | 1 – 6 |
| Thermal Conductivity | 1 – 4 W/m·K | 0.3 – 5 W/m·K |
| Max Board Size | 1500 × 600 mm | 1200 × 600 mm |
| Board Thickness | 0.8 – 5.0 mm | 0.4 – 3.0 mm |
| Copper Weight | 1 – 3 oz (standard); up to 33 oz | 0.5 – 4 oz; up to 33 oz |
| Min Trace / Spacing | 3 mil / 3 mil | 4 mil / 4 mil |
| Min Hole Size | 0.2 mm (8 mil) | 0.3 mm |
| Solder Mask Color | White, Black, Green, Super White, Solar, Carbon Ink | White, Black, Green, Super White, Solar, Carbon Ink |
| Surface Finish | HASL (lead-free), ENIG, Hard Gold, Immersion Silver, Gold Fingers | HASL (lead-free), ENIG, Hard Gold, Immersion Silver, Gold Fingers |
| China Mainland Base | Malaysia Base | Mexico Base |
|---|---|---|---|
| Turnkey Service | Design + PCB FAB + Components Sourcing + PCB Assembly + Product Assembly | Components Sourcing + PCB Assembly + Product Assembly | Components Sourcing + PCB Assembly |
| Assembly Technologies | THT, SMT, Hybrid Mount, Subsystem Assembly | THT, SMT, Hybrid Mount, Semi Assembly | THT, SMT, Hybrid Mount, Subsystem Assembly |
| Manufacturing Abilities | Prototyping, Low to High Volume | Prototyping, Low/Medium/High Volume | Prototyping, Low to Medium Volume |
| Component Abilities | Chips 0201mm BGA, QFP & CSP 0.25mm BGA repair and reball | Chips 0402mm BGA, QFP & CSP 0.25mm HDMI Connectors / Micro USB Connectors | Chips 0402mm BGA, QFP & CSP 0.3mm Press Fit / High Pin Count Connectors |
| SMT Lines | 11 Lines, Samsung / JT | 9 Lines, Samsung / Panasonic / Sony | 5 Lines, Siemens / Samsung |
| SMT Capabilities | Monthly 788 Million Points | Monthly 298 Million Points | Monthly 63 Million Points |
| THT Lines | 3 Lines, Auto / Manual | 4 Lines, Auto / Manual | 2 Lines, Auto / Manual |
| Inspection Machines | SPI, AOI, 2D X-Ray | SPI, Optical Measuring (VMS-4030M), X-ray (SMX-1000) | SPI, AOI, X-ray, Microscope to 20X |
| Testing | ICT/Function test/Burn-in test/Aging Testing | ICT/Function test/Burn-in test | ICT/Function test/Burn-in test |
| Assembly Cost | Lower Costs | Lower Costs | Medium Cost |
| Lead Time | As fast as 9 days with shipping | As fast as 7 days with shipping | As fast as 3 days with shipping |
| Number of layers | S<1m² | 1≤S<5m² | 5≤S<20m² | 20≤S<50m² | 50≤S<100m² | 100m²以上 | Expedited (≤3㎡) |
|---|---|---|---|---|---|---|---|
| 2L | 4 | 5-7 | 5-7 | 6-9 | 8-10 | 9-12 | 12~24 hours |
| 4L | 5 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 1~4 working days |
| 6L | 6 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 2~4 working days |
| 8L | 7 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 4~6 working days |
| 10L | 9 | 9-11 | 9-11 | 10-12 | 12-14 | 13-17 | 5~9 working days |
| 12L | 10 | 10-12 | 10-12 | 11-13 | 13-15 | 14-18 | 7~14 working days |
| 14L | 10 | 10-12 | 10-12 | 11-13 | 13-15 | 14-18 | 7~14 working days |
| 16L | 11 | 13 | 13 | 15 | 16 | 17 | Contingent |
| 18L | 12 | 14 | 14 | 16 | 17 | 18 | Contingent |
| 20L | 13 | 14 | 14 | 16 | 18 | 19 | Contingent |
| 22L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 24L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 26L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 28L+ | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
Commitment to Quality
Certification Compliance Support
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Support for ISO 9001 quality management system
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Compliance with ISO 14001 environmental management system
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Adherence to ISO 45001 occupational health and safety standards
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Compliance with IPC-A-610 and IPC J-STD-001 standards
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Support for RoHS / REACH environmental compliance
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Support for UL and CE certifications
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Support for ISO 13485, IEC 62031, and other industry-specific certifications
Manufacturing Process Control
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Full BOM and lot traceability across production
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Material traceability (components, boards, solder paste, etc.)
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Process documentation for regulated manufacturing
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First Article Inspection (FAI) support
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In-process quality checks and monitoring
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Controlled ESD & cleanroom processes (if applicable)
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Complete inspection records and test reports
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Change control and nonconformance management
End-to-End Solutions
PCBCool’s capabilities go beyond manufacturing to offer a full end-to-end delivery system. We provide flexible and customized MCPCB solutions tailored to your specific project requirements.
Cutting-Edge Technologies
PCBCool’s factories are equipped with advanced drilling and processing equipment, including Taliang NTL-DG6H, YAYA SC-200, Jung Chao MDP-10, and RYOSEI 40HP, ensuring high-precision execution for complex MCPCB projects.
Why Choose PCBCool as Your MCPCB Manufacturer
MCPCB manufacturing and assembly projects demand exceptional thermal management, high current carrying capacity, and precise processing.
If you want your engineering team involved early in the project to provide proactive support—
Case Studies
Frequently Asked Questions
A: Yes, MCPCB is also known as IMS (Insulated Metal Substrate). They are essentially the same, with different naming conventions.
A: Common materials include aluminum and copper. Aluminum is the most widely used due to its balance of cost and performance, while copper is suitable for higher power density applications. In some special cases, stainless steel or customized metal alloys may also be used, though less common.
A: Metal core typically refers to a PCB structure that includes a metal base within the board, while metal-backed PCB usually refers to a structure where an additional metal layer is attached to the back of the PCB for heat dissipation.
A: Thermal performance mainly depends on the dielectric layer. Standard aluminum-based MCPCBs typically offer thermal conductivity of about 1–4 W/m·K, while copper-based solutions can reach approximately 3–5 W/m·K.
A: For mechanical drilling, the minimum hole size on metal substrates is typically around 0.2 mm. Smaller holes require laser drilling, which is more challenging due to the presence of the metal layer and must be evaluated based on the specific design.
A: Current-carrying capacity depends on copper thickness, trace width, and thermal design. Thick copper structures (such as 10 oz and above), combined with proper layout, can support high-current applications such as power modules and power electronics systems.
A: Yes. This is typically achieved using a metal-backed structure combined with high-frequency materials such as Rogers or Taconic, enabling both effective heat dissipation and RF performance in a hybrid design.
A: MCPCB manufacturing is more complex, especially in drilling metal layers, which leads to higher tool wear and longer processing time. In addition, material costs and yield control requirements are higher.
A: Yes, we offer one-stop services from bare board manufacturing to full PCBA assembly. Whether it is consigned assembly or turnkey solutions, we can support based on your project requirements.
A: Yes. At the early stage of the project, our engineering team can provide DFM analysis, thermal design optimization suggestions, and material selection support to reduce risks and improve reliability.
A: Yes, we have the capability to manufacture thick copper MCPCBs, supporting up to 33 oz copper thickness, suitable for high-current and high-power applications.
A: Due to the complexity of MCPCB manufacturing, lead time depends on the design structure and process requirements. For urgent projects, expedited services are available upon evaluation.
A: Simply provide Gerber files, BOM list, or technical requirements. Our team will quickly complete engineering evaluation and provide a quotation along with optimization suggestions.
With PCBCool, You Get More Than Assembly
you get a partner committed to zero defects, global compliance, and lasting reliability.
