Technologies We Offer
- Advanced PCB Fabrication, PCBA & Box Build Capabilities
- High-Density, High-Speed, and Precision Solutions
- Compliance-Driven Manufacturing for Critical Industries
Experience Drives Innovation
With over 20 years of expertise in electronics manufacturing, we’ve earned the trust of industries ranging from consumer electronics to automotive and medical devices. Our experience empowers us to provide specialized solutions for even the most complex projects.
Equipped with 5 advanced manufacturing facilities, we deliver a broad range of capabilities: from traditional 1-40 layer rigid boards to high-precision 1-6 layer flexible PCBs, 4+N+4 HDI, 30 oz thick copper, 01005 packages, and 0.25mm BGA. We also offer CNC and 3D-printed enclosures, ensuring flexibility in every aspect of production.
Our technical depth, combined with a commitment to innovation, ensures we consistently deliver reliable solutions tailored to your needs.
Manufacturing Technologies
Materials Technologies
Assembly Technologies
Box Build Technologies
Quality Assurance Technologies
Worldwide Manufacturing Network
PCBCool provides seamless support for customers worldwide, ensuring consistent quality, fast response, and localized project management.
Our global network enables flexible prototyping, scalable production, and reliable delivery wherever your product is manufactured.
Global Coverage
Offices and support teams in China, Malaysia, and Mexico allow timely communication and regulatory guidance across multiple regions.
Local Project Support
Dedicated project managers coordinate prototypes, production, and delivery to ensure smooth execution and customer satisfaction.
Fast & Flexible Delivery
Multi-region production and supply chain management allow rapid prototyping and scalable volume production with consistent quality.
Case Studies
Frequently Asked Questions
A: We support up to 40 layers for complex designs.
A: We can achieve trace widths and spacing as small as 64μm (2.5 mils).
A: Yes, we can drill vias as small as 0.08mm (laser drilling) and 0.15mm (mechanical drilling).
A: We can handle BGA ball pitches down to 0.25mm, with flip-chip and X-ray inspection for precise soldering.
A: We can handle copper thicknesses up to 33 oz (1 oz = 35µm).
A: Yes, we offer rapid prototyping with lead times as short as 3-7 days for small batches and design validation.
A: We can produce 1-2 layer PCBs up to 1500mm x 600mm and multilayer PCBs up to 620mm x 720mm.
A: We perform X-ray inspection on all PCB assemblies, not just BGA components, to detect hidden solder joint defects and misalignments.
A: We can place components as small as 01005.
A: Yes, we can create multi-material stackups, such as Rogers/FR4 hybrid designs, for high-frequency or high-power applications.
A: Yes, we can assemble QFNs and LGAs with precision soldering and inspection.
A: Yes, we offer 3D CAD models to visualize the design and ensure proper component placement before manufacturing.
A: We specialize in low-volume, high-mix production, providing custom prototyping and rapid iterations.
A: Functional testing ensures the PCB performs its intended function, verifying all connections and components work as expected.
A: We can manufacture custom-shaped PCBs using CNC cutting or laser etching to meet design specifications.
A: Yes, we use lead-free soldering processes compliant with RoHS standards.
A: Yes, we can manufacture ultra-thin PCBs with thicknesses starting from 0.037mm. The minimum thickness varies by layers:
- 2-layer: 0.1mm
- 4-layer: 0.4mm
- 6-layer: 0.6mm
- 8-layer: 0.8mm
- 10-layer: 1mm
- More than 10 layers: 0.5 * layer count * 0.2mm.
A: Yes, we offer DFM reviews to ensure your design is optimized for manufacturability, cost-effectiveness, and high-yield production.