{"id":34916,"date":"2025-12-24T18:27:06","date_gmt":"2025-12-24T10:27:06","guid":{"rendered":"https:\/\/pcbcool.com\/?p=34916"},"modified":"2026-01-04T19:21:35","modified_gmt":"2026-01-04T11:21:35","slug":"0-25mm-fine-pitch-prototype-pcb-assembly-for-semiconductor-validation","status":"publish","type":"post","link":"https:\/\/pcbcool.com\/pt-br\/case-studies\/0-25mm-fine-pitch-prototype-pcb-assembly-for-semiconductor-validation\/","title":{"rendered":"Montagem de Prot\u00f3tipos de PCB com Passo Fino de 0,25 mm para Valida\u00e7\u00e3o de Semicondutores"},"content":{"rendered":"<div data-elementor-type=\"wp-post\" data-elementor-id=\"34916\" class=\"elementor elementor-34916\" data-elementor-post-type=\"post\">\n\t\t\t\t<div class=\"wd-negative-gap elementor-element elementor-element-6bff3ff e-flex e-con-boxed e-con e-parent\" data-id=\"6bff3ff\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-6abee4e e-con-full e-flex e-con e-child\" data-id=\"6abee4e\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-6d0ac02 color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"6d0ac02\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Para uma empresa de semicondutores como nosso cliente americano, o \u201cValidation Gap\u201d \u00e9 o momento mais tenso do ciclo de P&amp;D. Voc\u00eas acabaram de receber o primeiro lote de sil\u00edcio prot\u00f3tipo da f\u00e1brica. Esses chips s\u00e3o incrivelmente caros. S\u00e3o escassos. E a equipe de engenharia est\u00e1 aguardando para verificar se a nova arquitetura funciona.<\/p><p>Para fazer isso, voc\u00ea precisa de um quadro de valida\u00e7\u00e3o.<\/p><p>O cliente nos enviou uma consulta para exatamente isso. O volume do pedido era m\u00ednimo \u2014 apenas 10 unidades. Mas a densidade t\u00e9cnica era alta. Cada placa exigia mais de 300 componentes, com montagem em ambos os lados, superior e inferior.<\/p><p>O problema real n\u00e3o era a quantidade. Era a pegada. O design apresentava um prot\u00f3tipo BGA com um passo de esfera de 0,25 mm e exigia o uso extensivo de componentes passivos 01005 (c\u00f3digo imperial).<\/p><p>Isso coloca o projeto em uma situa\u00e7\u00e3o dif\u00edcil.<\/p><ul><li><em>Oficinas de Prot\u00f3tipos Padr\u00e3o:<\/em> Eles podem entregar rapidamente (24-48 horas), mas a capacidade de seu processo geralmente para em um passo de 0,4 mm. Raramente possuem pasta Tipo 6 ou inspe\u00e7\u00e3o por raio-X.<\/li><li><em>EMS N\u00edvel 1:<\/em> Eles possuem a tecnologia, mas n\u00e3o t\u00eam interesse em um pedido de 10 pe\u00e7as. Mesmo que aceitem, a configura\u00e7\u00e3o do NPI (Introdu\u00e7\u00e3o de Novo Produto) leva de 3 a 4 semanas.<\/li><\/ul><p>O cliente necessitava de uma solu\u00e7\u00e3o de montagem de PCB de r\u00e1pida entrega (Quick Turn) que pudesse lidar com a montagem de BGA de passo fino em 7 dias.<\/p><p>Segue a an\u00e1lise de engenharia de como resolvemos o problema.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f42f3a5 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"f42f3a5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-primary wd-title-style-underlined wd-title-size-large text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h2 class=\"woodmart-title-container title wd-fontsize-xxl\">Desafios e Restri\u00e7\u00f5es Principais<\/h2> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8e0f916 color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"8e0f916\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Ao revisarmos os arquivos Gerber, identificamos tr\u00eas restri\u00e7\u00f5es prim\u00e1rias que tornaram esta uma situa\u00e7\u00e3o de \u201cAlta Mistura e Baixo Volume\u201d um pesadelo para linhas de montagem padr\u00e3o.<\/p><table><thead><tr><th>Funcionalidade<\/th><th>Especifica\u00e7\u00e3o<\/th><th>Por que \u00e9 dif\u00edcil<\/th><\/tr><\/thead><tbody><tr><td>Afazamento BGA<\/td><td>0,25 mm<\/td><td>A folga entre as esferas \u00e9 t\u00e3o pequena que a pasta de solda padr\u00e3o n\u00e3o se soltar\u00e1 do est\u00eancil.<\/td><\/tr><tr><td>Passivas<\/td><td>01005 (0,4 x 0,2 mm)<\/td><td>A massa \u00e9 de 0,04 mg. Eles s\u00e3o propensos a \u201ctombstoning\u201d (ficarem em p\u00e9) se o fluxo de ar ou o calor forem desiguais.<\/td><\/tr><tr><td>Estrutura<\/td><td>SMT Dupla Face<\/td><td>A placa passa pelo forno duas vezes. O primeiro lado corre o risco de oxida\u00e7\u00e3o ou queda de componentes durante a segunda passagem.<\/td><\/tr><tr><td>Material<\/td><td>Sil\u00edcio Prot\u00f3tipo<\/td><td>Requisito de Defeito Zero. N\u00e3o podemos simplesmente \u201cretravabalar\u201d um chip prot\u00f3tipo danificado.<\/td><\/tr><\/tbody><\/table>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-53aff67 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"53aff67\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-primary wd-title-style-underlined wd-title-size-large text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h2 class=\"woodmart-title-container title wd-fontsize-xxl\">Solu\u00e7\u00f5es de Engenharia PCBCool<\/h2> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-090eb95 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"090eb95\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-medium text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h3 class=\"woodmart-title-container title wd-fontsize-xl\">Est\u00e1gio 1: Solucionando a F\u00edsica do Est\u00eancil BGA de 0,25 mm<\/h3> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4badf82 color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"4badf82\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>O primeiro obst\u00e1culo foi colocar a pasta de solda na PCB. Para um BGA com passo de 0,25 mm, a f\u00edsica da impress\u00e3o de pasta de solda come\u00e7a a falhar.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-012fe3d wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"012fe3d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-small text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h4 class=\"woodmart-title-container title wd-fontsize-m\">O C\u00e1lculo da Raz\u00e3o de \u00c1rea<\/h4> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ee1787d color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"ee1787d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Para obter uma boa impress\u00e3o, a pasta de solda deve se soltar da abertura do stencil e aderir \u00e0 placa de circuito impresso (PCI). Isso \u00e9 regido pela Raz\u00e3o de \u00c1rea (RA).<\/p><p><img loading=\"lazy\" decoding=\"async\" class=\"wd-lazy-fade aligncenter wp-image-34937 size-full\" src=\"https:\/\/pcbcool.com\/wp-content\/themes\/woodmart\/images\/lazy.svg\" data-src=\"https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Area-Ratio-AR-Calculation-Formula.jpg\" alt=\"F\u00f3rmula de C\u00e1lculo da Raz\u00e3o de \u00c1rea (AR)\" width=\"1016\" height=\"144\" srcset=\"\" data-srcset=\"https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Area-Ratio-AR-Calculation-Formula.jpg 1016w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Area-Ratio-AR-Calculation-Formula-150x21.jpg 150w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Area-Ratio-AR-Calculation-Formula-600x85.jpg 600w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Area-Ratio-AR-Calculation-Formula-400x57.jpg 400w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Area-Ratio-AR-Calculation-Formula-768x109.jpg 768w\" sizes=\"auto, (max-width: 1016px) 100vw, 1016px\" \/><\/p><p>A norma do setor (IPC-7525) estipula que o AR deve ser &gt;0,66.<\/p><p>Examinemos os n\u00fameros deste projeto:<\/p><ul><li><em>Di\u00e2metro da Abertura:<\/em> 100 \u00b5m (0,1 mm) para um passo de 0,25 mm.<\/li><li><em>Espessura Padr\u00e3o do Est\u00eancil:<\/em> 100 \u00b5m (0,1 mm ou 4 mil).<\/li><\/ul><p><img loading=\"lazy\" decoding=\"async\" class=\"wd-lazy-fade alignnone wp-image-34941 size-full\" src=\"https:\/\/pcbcool.com\/wp-content\/themes\/woodmart\/images\/lazy.svg\" data-src=\"https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/The-result-obtained-after-substituting-the-values-\u200b\u200binto-the-area-ratio-AR-calculation-formula.jpg\" alt=\"O resultado obtido ap\u00f3s a substitui\u00e7\u00e3o dos valores na f\u00f3rmula de c\u00e1lculo da raz\u00e3o de \u00e1rea (AR)\" width=\"951\" height=\"164\" srcset=\"\" data-srcset=\"https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/The-result-obtained-after-substituting-the-values-\u200b\u200binto-the-area-ratio-AR-calculation-formula.jpg 951w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/The-result-obtained-after-substituting-the-values-\u200b\u200binto-the-area-ratio-AR-calculation-formula-150x26.jpg 150w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/The-result-obtained-after-substituting-the-values-\u200b\u200binto-the-area-ratio-AR-calculation-formula-600x103.jpg 600w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/The-result-obtained-after-substituting-the-values-\u200b\u200binto-the-area-ratio-AR-calculation-formula-400x69.jpg 400w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/The-result-obtained-after-substituting-the-values-\u200b\u200binto-the-area-ratio-AR-calculation-formula-768x132.jpg 768w\" sizes=\"auto, (max-width: 951px) 100vw, 951px\" \/><\/p><p>Resultado: 0,25 est\u00e1 muito abaixo de 0,66.<\/p><p>Se utiliz\u00e1ssemos um processo padr\u00e3o, a pasta de solda entupiria a m\u00e1scara. As pastilhas BGA receberiam pouca ou nenhuma solda, resultando em defeitos de N\u00e3o-Molhagem Aberta (NWO).<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b368e6f wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"b368e6f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-small text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h4 class=\"woodmart-title-container title wd-fontsize-m\">A Mudan\u00e7a de Material: Pasta Tipo 6<\/h4> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8d5f66d color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"8d5f66d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-size: 15px;\">N\u00e3o pudemos alterar o espa\u00e7amento BGA, portanto tivemos que mudar os materiais.<\/span><\/p><p>A maioria dos assemblers utiliza pasta de solda Tipo 4 (tamanho de part\u00edcula de 20\u201338 \u00b5m). \u00c9 econ\u00f4mica e est\u00e1vel. Mas, para esta montagem, as part\u00edculas Tipo 4 s\u00e3o grandes demais para os furos de 100 \u00b5m.<\/p><p>N\u00f3s mudamos para <strong>Pasta de Solda Sem Chumbo Tipo 6<\/strong> (Liga SAC305).<\/p><ul><li><em>Tamanho de Part\u00edcula:<\/em> 5\u201315 \u00b5m.<\/li><li><em>Benef\u00edcio<\/em> A consist\u00eancia \u201csemelhante a poeira\u201d permite que ele se acomode nas pequenas aberturas e seja liberado de forma limpa.<\/li><\/ul><p><strong>(Observa\u00e7\u00e3o: a pasta tipo 6 \u00e9 cara e sens\u00edvel. Ela tem menor prazo de validade e reage mais rapidamente \u00e0 oxida\u00e7\u00e3o. Precisamos mant\u00ea-la refrigerada a 4\u00b0C e retir\u00e1-la apenas pouco antes do ciclo de impress\u00e3o.)<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5ca5fd7 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"5ca5fd7\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-small text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h4 class=\"woodmart-title-container title wd-fontsize-m\">A Atualiza\u00e7\u00e3o do Stencil<\/h4> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-894ac07 color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"894ac07\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-size: 15px;\">Tamb\u00e9m modificamos o m\u00e9todo de fabrica\u00e7\u00e3o do stencil. Um stencil cortado a laser padr\u00e3o possui paredes \u00e1speras (microrebarbas) que ret\u00eam a pasta.<\/span><\/p><p>Utilizamos uma m\u00e1scara de a\u00e7o inoxid\u00e1vel SUS301 com Eletropolimento. O processo de eletropolimento suaviza as paredes da abertura, reduzindo o atrito da tens\u00e3o superficial e permitindo que a pasta deslize para fora.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3aa2dde wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"3aa2dde\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-medium text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h3 class=\"woodmart-title-container title wd-fontsize-xl\">Est\u00e1gio 2: O Risco de Tombstoning 01005<\/h3> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4b935f7 color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"4b935f7\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>O segundo risco principal foram os capacitores 01005. Essas pe\u00e7as pesam 0,04 mg. A tens\u00e3o superficial da solda fundida \u00e9 forte o suficiente para levant\u00e1-los verticalmente \u2014 um defeito chamado \u201cefeito l\u00e1pide\u201d (tombstoning).\u201d<\/p>\n<p>Por que isso acontece<\/p>\n<p>Tombstoning \u00e9 um problema de temporiza\u00e7\u00e3o. Se a solda na pastilha esquerda derrete 0,5 segundos antes da solda na pastilha direita, a for\u00e7a de molhagem puxa o componente para cima.<\/p>\n<p>Isso geralmente ocorre devido a um layout de PCB inadequado: se um pad se conecta a uma trilha fina e o outro se conecta a um grande plano de terra de cobre, o plano de terra atua como um dissipador de calor, atrasando o derretimento.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d105d90 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"d105d90\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-small text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h4 class=\"woodmart-title-container title wd-fontsize-m\">Interven\u00e7\u00e3o de DFM<\/h4> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-aa9fe6c color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"aa9fe6c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Antes de cortarmos o est\u00eancil, nossos engenheiros de DFM (Design for Manufacturability) revisaram os arquivos Gerber. Identificamos 3 \u00e1reas onde as defini\u00e7\u00f5es de pad para os componentes 01005 apresentavam riscos.<\/p><ul><li><em>Quest\u00e3o:<\/em> Al\u00edvio t\u00e9rmico assim\u00e9trico.<\/li><li><em>A\u00e7\u00e3o:<\/em> Informamos o cliente. Recomendamos modificar as aberturas da m\u00e1scara para garantir a \u201cSimetria Bilateral Absoluta\u201d.<\/li><li><em>Regra Geral:<\/em> Para 01005s, a abertura da m\u00e1scara de solda deve ser Non-Solder Mask Defined (NSMD) ou estritamente controlada para garantir exposi\u00e7\u00e3o de cobre igual.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d737e74 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"d737e74\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-small text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h4 class=\"woodmart-title-container title wd-fontsize-m\">Posicionamento de Precis\u00e3o<\/h4> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a62c5d1 color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"a62c5d1\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Colocar estas pe\u00e7as na placa exige extrema delicadeza.<\/p><ul><li><em>Controle de For\u00e7a:<\/em> Definimos a for\u00e7a do bico do Pick-and-Place como <strong>1 Newton<\/strong>. For\u00e7a padr\u00e3o (3-4N) racharia o corpo cer\u00e2mico de um 01005.<\/li><li><em>Sistema de Vis\u00e3o:<\/em> As verifica\u00e7\u00f5es padr\u00e3o de v\u00e1cuo n\u00e3o funcionam bem aqui \u2014 a pe\u00e7a \u00e9 muito pequena para bloquear o fluxo de ar de maneira confi\u00e1vel. Utilizamos o Alinhamento a Laser para verificar se a pe\u00e7a estava no bico antes da coloca\u00e7\u00e3o.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1851506 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"1851506\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-medium text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h3 class=\"woodmart-title-container title wd-fontsize-xl\">Est\u00e1gio 3: A Atmosfera de Refluxo \u201cCachinhos Dourados\u201d<\/h3> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-21528f6 color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"21528f6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Soldar em ar \u00e9 aceit\u00e1vel para resistores grandes. Para BGAs de 0,25 mm e 01005, \u00e9 uma receita para o fracasso. O oxig\u00eanio causa oxida\u00e7\u00e3o r\u00e1pida nas min\u00fasculas esferas de p\u00f3 de solda da pasta Tipo 6.<\/p><p>Utilizamos um <strong>Nitrog\u00eanio (N2) Refluxo<\/strong> processo. Mas voc\u00ea n\u00e3o pode simplesmente usar nitrog\u00eanio puro.<\/p><p><img loading=\"lazy\" decoding=\"async\" class=\"wd-lazy-fade aligncenter wp-image-34952 size-full\" src=\"https:\/\/pcbcool.com\/wp-content\/themes\/woodmart\/images\/lazy.svg\" data-src=\"https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Nitrogen-N2-Reflow-production-line.jpg\" alt=\"Linha de produ\u00e7\u00e3o de reflow de nitrog\u00eanio (N2)\" width=\"1024\" height=\"768\" srcset=\"\" data-srcset=\"https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Nitrogen-N2-Reflow-production-line.jpg 1024w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Nitrogen-N2-Reflow-production-line-150x113.jpg 150w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Nitrogen-N2-Reflow-production-line-600x450.jpg 600w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Nitrogen-N2-Reflow-production-line-400x300.jpg 400w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/Nitrogen-N2-Reflow-production-line-768x576.jpg 768w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-063ec63 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"063ec63\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-small text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h4 class=\"woodmart-title-container title wd-fontsize-m\">A Compensa\u00e7\u00e3o dos PPM de Oxig\u00eanio<\/h4> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-dc0117a color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"dc0117a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Existe uma janela espec\u00edfica para a concentra\u00e7\u00e3o de oxig\u00eanio: <a href=\"https:\/\/www.emerald.com\/ssmt\/article\/29\/3\/144\/362591\/Reflow-of-tiny-01005-capacitor-SAC305-solder\" target=\"_blank\" rel=\"nofollow noopener\">1.000 a 2.000 ppm<\/a>.<\/p><ul><li><em>Cen\u00e1rio A:<\/em> Excessivamente Limpo (&lt; 500 ppm O2)<\/li><\/ul><p>Se o ambiente for excessivamente puro, a tens\u00e3o de molhagem torna-se muito forte. A solda adere instantaneamente \u00e0 ilha. Essa molhagem agressiva, na verdade, aumenta o torque nos componentes 01005, causando mais tombstoning.<\/p><ul><li><em>Cen\u00e1rio B:<\/em> Muito Sujo (&gt; 3000 ppm O2)<\/li><\/ul><p>O p\u00f3 de pasta Tipo 6 oxida. Isso leva a defeitos de \u201cGraping\u201d (onde a solda se assemelha a um cacho de uvas n\u00e3o fundidas) e \"Head-on-Pillow\" no BGA.<\/p><p>N\u00f3s ajustamos nossos fornos para manter uma temperatura constante <strong>1500 ppm de O2<\/strong>. Isso nos deu a zona \u201cCachinhos Dourados\u201d: boa molhabilidade para o BGA, mas tens\u00e3o superficial gerenci\u00e1vel para os 01005.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6099ca4 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"6099ca4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-small text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h4 class=\"woodmart-title-container title wd-fontsize-m\">O Perfil de Imers\u00e3o<\/h4> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f4f3d3e color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"f4f3d3e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Tamb\u00e9m utilizamos um perfil de \u201cSoak\u201d em vez de uma rampa linear. Mantivemos a temperatura entre 150\u00b0C e 200\u00b0C por 90 segundos.<\/p><p>Essa pausa permite que o cobre da placa de circuito impresso (PCB), o corpo do BGA e os componentes passivos min\u00fasculos atinjam a mesma temperatura antes da solda derreter. O equil\u00edbrio t\u00e9rmico \u00e9 a melhor defesa contra o efeito \"tombstone\".<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f46fa94 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"f46fa94\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-medium text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h3 class=\"woodmart-title-container title wd-fontsize-xl\">Est\u00e1gio 4: Inspe\u00e7\u00e3o e Verifica\u00e7\u00e3o<\/h3> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-c0fc022 color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"c0fc022\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Para a montagem de uma placa de valida\u00e7\u00e3o de semicondutores, n\u00e3o se pode assumir que uma junta est\u00e1 boa apenas porque parece correta. As juntas cr\u00edticas est\u00e3o ocultas sob o BGA.<\/p><p><img loading=\"lazy\" decoding=\"async\" class=\"wd-lazy-fade aligncenter wp-image-34959 size-full\" src=\"https:\/\/pcbcool.com\/wp-content\/themes\/woodmart\/images\/lazy.svg\" data-src=\"https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/3D-SPI-is-used-to-inspect-hidden-solder-joints-under-BGA-packages.jpg\" alt=\"A SPI 3D \u00e9 utilizada para inspecionar juntas de solda ocultas sob encapsulamentos BGA.\" width=\"1024\" height=\"576\" srcset=\"\" data-srcset=\"https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/3D-SPI-is-used-to-inspect-hidden-solder-joints-under-BGA-packages.jpg 1024w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/3D-SPI-is-used-to-inspect-hidden-solder-joints-under-BGA-packages-150x84.jpg 150w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/3D-SPI-is-used-to-inspect-hidden-solder-joints-under-BGA-packages-600x338.jpg 600w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/3D-SPI-is-used-to-inspect-hidden-solder-joints-under-BGA-packages-400x225.jpg 400w, https:\/\/pcbcool.com\/wp-content\/uploads\/2025\/12\/3D-SPI-is-used-to-inspect-hidden-solder-joints-under-BGA-packages-768x432.jpg 768w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p><p>Inspecionamos a deposi\u00e7\u00e3o da pasta de solda antes da montagem dos componentes.<\/p><ul><li><em>Por qu\u00ea:<\/em> Se a impress\u00e3o estiver com defeito, limpar a placa e reimprimir custa $5. Se detectarmos o defeito ap\u00f3s o reflow, a placa \u00e9 descartada (o que custa milhares).<\/li><li><em>Padr\u00e3o<\/em> Buscamos consist\u00eancia no volume. Qualquer bloco com volume &lt;70% foi rejeitado.<\/li><\/ul><p>100% AXI (Inspe\u00e7\u00e3o Automatizada por Raios X)<\/p><p>Isso foi obrigat\u00f3rio. N\u00f3s radiografamos cada BGA.<\/p><p>Est\u00e1vamos procurando por dois assassinos espec\u00edficos:<\/p><ul><li><em>Cabe\u00e7a no Travesseiro (HoP):<\/em> Onde a esfera BGA repousa na pasta de solda, mas n\u00e3o se funde. Isso cria uma conex\u00e3o el\u00e9trica intermitente que enlouquece os engenheiros de valida\u00e7\u00e3o.<\/li><li><em>Anula\u00e7\u00e3o:<\/em> Bolhas de ar presas na junta. Verificamos que o vazamento total foi \u2264 15% da \u00e1rea da junta.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5e5baa3 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"5e5baa3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-primary wd-title-style-underlined wd-title-size-large text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h2 class=\"woodmart-title-container title wd-fontsize-xxl\">Considera\u00e7\u00f5es Finais<\/h2> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7bbfb84 color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"7bbfb84\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>O projeto avan\u00e7ou atrav\u00e9s do nosso <strong>Fabrica\u00e7\u00e3o de NPI Completa<\/strong> Linha r\u00e1pida.<\/p><ul><li><em>Dia 1-3:<\/em> Fabrica\u00e7\u00e3o de PCB (Turno r\u00e1pido, garantindo planicidade <a href=\"https:\/\/resources.altium.com\/p\/microvia-sizing-your-next-multi-layer-pcb\" target=\"_blank\" rel=\"nofollow noopener\">Almofadas VIP<\/a>). Obten\u00e7\u00e3o de componentes da Digi-Key\/Mouser.<\/li><li><em>Dia 4:<\/em> Revis\u00e3o DFM e Fabrica\u00e7\u00e3o de Est\u00eancil (Eletropolido).<\/li><li><em>Dia 5:<\/em> Montagem SMT (Lado Superior).<\/li><li><em>6\u00ba Dia:<\/em> Montagem SMT (Lado Inferior) e Inspe\u00e7\u00e3o por Raios-X.<\/li><li><em>Dia 7:<\/em> FCT (Teste Funcional) Final e Expedi\u00e7\u00e3o.<\/li><\/ul><p>Entregamos todas as 10 placas no prazo. <strong>A taxa de aproveitamento na primeira passagem foi de 100%<\/strong>.<\/p><p>Para o cliente, isso significou que eles poderiam iniciar a valida\u00e7\u00e3o do sil\u00edcio imediatamente, sem se preocupar se um erro de montagem da placa estava mascarando um bug do chip.<\/p><p>Se voc\u00ea estiver projetando placas de valida\u00e7\u00e3o com passo de 0,3 mm ou menor, n\u00e3o deixe a montagem ao acaso. Entre em contato <a href=\"https:\/\/pcbcool.com\/pt-br\/\">PCBCool<\/a> para uma revis\u00e3o gratuita de DFM (Design for Manufacturing) de sua pr\u00f3xima fabrica\u00e7\u00e3o NPI (New Product Introduction). Podemos identificar os riscos antes que voc\u00ea corte o stencil.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"wd-negative-gap elementor-element elementor-element-1620e06 e-flex e-con-boxed e-con e-parent\" data-id=\"1620e06\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-002415e e-con-full e-flex e-con e-child\" data-id=\"002415e\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"elementor-element elementor-element-d03ca06 e-con-full e-flex e-con e-child\" data-id=\"d03ca06\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9c373aa wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"9c373aa\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-primary wd-title-style-underlined wd-title-size-large text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<h2 class=\"woodmart-title-container title wd-fontsize-xxl\">Perguntas Frequentes (FAQ)<\/h2> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a8ce272 elementor-widget elementor-widget-wd_accordion\" data-id=\"a8ce272\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_accordion.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\n\t\t<div class=\"wd-accordion wd-style-default wd-titles-left wd-opener-pos-left wd-opener-style-arrow\" data-state=\"first\">\n\t\t\t\t\t\t\t\n\t\t\t\t<div class=\"wd-accordion-item\">\n\t\t\t\t\t<div class=\"wd-accordion-title wd-role-btn wd-active\" data-accordion-index=\"0\" tabindex=\"0\">\n\t\t\t\t\t\t<div class=\"wd-accordion-title-text\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span>\n\t\t\t\t\t\t\t\t1. Por que n\u00e3o podemos usar pasta de solda padr\u00e3o Tipo 4 para BGAs de passo de 0,25 mm?\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<span class=\"wd-accordion-opener\"><\/span>\n\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<div class=\"wd-accordion-content wd-entry-content wd-active\" data-accordion-index=\"0\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t<p>A quest\u00e3o se resume ao tamanho da part\u00edcula versus o tamanho da abertura. Part\u00edculas de pasta Tipo 4 variam de 20\u201338 \u00b5m. Para um passo de 0,25 mm, a abertura do stencil tem frequentemente apenas 100 \u00b5m de largura. Part\u00edculas grandes podem obstruir essas pequenas aberturas, levando a uma transfer\u00eancia de pasta insuficiente. N\u00f3s usamos pasta Tipo 6 (5\u201315 \u00b5m) porque as esferas mais finas se soltam de forma limpa da abertura, garantindo que a esfera BGA entre em contato com o fluxo e a solda.<\/p>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\n\t\t\t\t<div class=\"wd-accordion-item\">\n\t\t\t\t\t<div class=\"wd-accordion-title wd-role-btn\" data-accordion-index=\"1\" tabindex=\"0\">\n\t\t\t\t\t\t<div class=\"wd-accordion-title-text\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span>\n\t\t\t\t\t\t\t\t2. Devo definir os pads como NSMD (Non-Solder Mask Defined) ou SMD para estas pe\u00e7as de passo fino?\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<span class=\"wd-accordion-opener\"><\/span>\n\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<div class=\"wd-accordion-content wd-entry-content\" data-accordion-index=\"1\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t<p>Para BGAs de 0,25 mm, geralmente recomendamos pads NSMD (Non-Solder Mask Defined). Eles proporcionam melhor precis\u00e3o de registro, pois o processo de grava\u00e7\u00e3o do cobre \u00e9 mais preciso do que a aplica\u00e7\u00e3o da m\u00e1scara de solda. No entanto, pads NSMD s\u00e3o mecanicamente mais fracos. Sugerimos adicionar um design de \"gota\" (teardrop) \u00e0 conex\u00e3o da trilha para evitar rachaduras no \"pesco\u00e7o\". Para componentes 01005, NSMD tamb\u00e9m \u00e9 prefer\u00edvel, mas \u00e9 preciso garantir que a m\u00e1scara entre os pads tenha no m\u00ednimo 100 \u00b5m para evitar pontes de solda.<\/p>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\n\t\t\t\t<div class=\"wd-accordion-item\">\n\t\t\t\t\t<div class=\"wd-accordion-title wd-role-btn\" data-accordion-index=\"2\" tabindex=\"0\">\n\t\t\t\t\t\t<div class=\"wd-accordion-title-text\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span>\n\t\t\t\t\t\t\t\t3. O(a) senhor(a) mencionou \u201c1500 ppm\u201d de oxig\u00eanio para reflow. Um valor pr\u00f3ximo de zero de oxig\u00eanio n\u00e3o seria melhor para prevenir a oxida\u00e7\u00e3o?\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<span class=\"wd-accordion-opener\"><\/span>\n\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<div class=\"wd-accordion-content wd-entry-content\" data-accordion-index=\"2\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t<p>Surpreendentemente, n\u00e3o. Embora o nitrog\u00eanio evite a oxida\u00e7\u00e3o, um ambiente excessivamente puro (&lt;500 ppm O2) cria for\u00e7as de molhagem que s\u00e3o agressivas demais. Para componentes 01005, esse \u201cmolhagem instant\u00e2nea\u201d aumenta o torque no componente, causando taxas mais altas de defeito &quot;tombstoning&quot;. Mantemos 1.000\u20132.000 ppm de O2 para equilibrar uma boa molhagem para os BGAs com tens\u00e3o superficial controlada para os componentes passivos.<\/p>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\n\t\t\t\t<div class=\"wd-accordion-item\">\n\t\t\t\t\t<div class=\"wd-accordion-title wd-role-btn\" data-accordion-index=\"3\" tabindex=\"0\">\n\t\t\t\t\t\t<div class=\"wd-accordion-title-text\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span>\n\t\t\t\t\t\t\t\tSe um capacitor 01005 falhar durante nossos testes de laborat\u00f3rio, voc\u00eas podem retrabalh\u00e1-lo?\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<span class=\"wd-accordion-opener\"><\/span>\n\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<div class=\"wd-accordion-content wd-entry-content\" data-accordion-index=\"3\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t<p>Desaconselhamos veementemente a retrabalhar componentes 01005. Pontas de solda padr\u00e3o s\u00e3o muito grandes e transferem calor de forma agressiva, o que frequentemente danifica as ilhas ou trinca o corpo cer\u00e2mico da pe\u00e7a de reposi\u00e7\u00e3o. Al\u00e9m disso, soldar componentes \u00e0 m\u00e3o \u00e9 extremamente dif\u00edcil de fazer de forma confi\u00e1vel. Se uma placa de prot\u00f3tipo falhar devido a um 01005 defeituoso, \u00e9 frequentemente mais seguro substituir a placa ou usar um sistema de reparo especializado por ar quente em vez de um ferro de solda.<\/p>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\n\t\t\t\t<div class=\"wd-accordion-item\">\n\t\t\t\t\t<div class=\"wd-accordion-title wd-role-btn\" data-accordion-index=\"4\" tabindex=\"0\">\n\t\t\t\t\t\t<div class=\"wd-accordion-title-text\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span>\n\t\t\t\t\t\t\t\t5. Quais s\u00e3o as regras de layout para microvias sob um BGA de 0,25 mm?\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<span class=\"wd-accordion-opener\"><\/span>\n\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<div class=\"wd-accordion-content wd-entry-content\" data-accordion-index=\"4\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t<p>\u00c9 necess\u00e1rio o uso de Microvia-in-Pad, mas a especifica\u00e7\u00e3o cr\u00edtica \u00e9 o acabamento. As vias devem ser preenchidas e metalizadas (VIPPO) para criar uma superf\u00edcie perfeitamente plana. Se houver qualquer reentr\u00e2ncia ou preenchimento incompleto, a pasta de solda escoar\u00e1 para dentro da via durante o reflow. Isso deixar\u00e1 a esfera BGA sem solda, causando um defeito de Non-Wet Open (NWO) que \u00e9 muito dif\u00edcil de detectar sem raio-x.<\/p>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-25114a5 elementor-widget elementor-widget-shortcode\" data-id=\"25114a5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"shortcode.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-shortcode\">\t\t\t<link rel=\"stylesheet\" id=\"elementor-post-36259-css\" href=\"https:\/\/pcbcool.com\/wp-content\/uploads\/elementor\/css\/post-36259.css?ver=1783499901\" type=\"text\/css\" media=\"all\">\n\t\t\t\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"36259\" class=\"elementor elementor-36259\" data-elementor-post-type=\"cms_block\">\n\t\t\t\t<div class=\"wd-negative-gap elementor-element elementor-element-0bd0376 e-flex e-con-boxed e-con e-parent\" data-id=\"0bd0376\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-0c2ef25 e-con-full e-flex e-con e-child\" data-id=\"0c2ef25\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"elementor-element elementor-element-55409b5 e-con-full e-flex e-con e-child\" data-id=\"55409b5\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-6020423 elementor-widget elementor-widget-image\" data-id=\"6020423\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"224\" height=\"224\" src=\"https:\/\/pcbcool.com\/wp-content\/themes\/woodmart\/images\/lazy.svg\" data-src=\"https:\/\/pcbcool.com\/wp-content\/uploads\/2026\/01\/Andy.jpg\" class=\"wd-lazy-fade attachment-full size-full wp-image-36265\" alt=\"Andy\" srcset=\"\" data-srcset=\"https:\/\/pcbcool.com\/wp-content\/uploads\/2026\/01\/Andy.jpg 224w, https:\/\/pcbcool.com\/wp-content\/uploads\/2026\/01\/Andy-150x150.jpg 150w\" sizes=\"auto, (max-width: 224px) 100vw, 224px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-2f36583 e-con-full e-flex e-con e-child\" data-id=\"2f36583\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e12b0a2 wd-width-100 elementor-widget elementor-widget-wd_title\" data-id=\"e12b0a2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"wd_title.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"title-wrapper wd-set-mb reset-last-child wd-title-color-default wd-title-style-default wd-title-size-default text-left\">\n\n\t\t\t\n\t\t\t<div class=\"liner-continer\">\n\t\t\t\t<div class=\"woodmart-title-container title wd-fontsize-l\">Andy | Especialista em Fabrica\u00e7\u00e3o e Montagem de PCBs<\/div> \n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-9dc5f9a e-con-full e-flex e-con e-child\" data-id=\"9dc5f9a\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9ecc86c color-scheme-inherit text-left elementor-widget elementor-widget-text-editor\" data-id=\"9ecc86c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Andy \u00e9 um profissional experiente na ind\u00fastria de placas de circuito impresso (PCBs), com d\u00e9cadas de experi\u00eancia em fabrica\u00e7\u00e3o, montagem e suporte ao cliente de PCBs. Na PCBCool, ele lidera a equipe de marketing e auxilia na transforma\u00e7\u00e3o de experi\u00eancias pr\u00e1ticas de projetos em conte\u00fado t\u00e9cnico \u00fatil para engenheiros, compradores e desenvolvedores de produtos.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-80d28ef elementor-widget elementor-widget-html\" data-id=\"80d28ef\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t\t<div class=\"custom-btn-wrapper\">\r\n  <a href=\"https:\/\/pcbcool.com\/pt-br\/author\/andy\/\" class=\"custom-btn\">Leia Mais Artigos de Andy \u2192<\/a>\r\n<\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Este estudo de caso apresenta a montagem de uma PCB prot\u00f3tipo de passo fino de 0,25 mm para valida\u00e7\u00e3o de semicondutores, destacando como BGAs de alta densidade e componentes 01005 foram montados com precis\u00e3o e rapidez.<\/p>","protected":false},"author":4,"featured_media":35011,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"Montagem de PCB Prot\u00f3tipo de Passo Fino de 0,25 mm para Valida\u00e7\u00e3o de Semicondutores | PCBCool","description":"Este estudo de caso apresenta a montagem de uma PCB prot\u00f3tipo de passo fino de 0,25 mm para valida\u00e7\u00e3o de semicondutores, destacando como BGAs de alta densidade e componentes 01005 foram montados com precis\u00e3o e rapidez."},"footnotes":""},"categories":[116],"tags":[],"post_folder":[],"class_list":["post-34916","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-case-studies"],"_links":{"self":[{"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/posts\/34916","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/comments?post=34916"}],"version-history":[{"count":0,"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/posts\/34916\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/media\/35011"}],"wp:attachment":[{"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/media?parent=34916"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/categories?post=34916"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/tags?post=34916"},{"taxonomy":"post_folder","embeddable":true,"href":"https:\/\/pcbcool.com\/pt-br\/wp-json\/wp\/v2\/post_folder?post=34916"}],"curies":[{"name":"WP","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}